Two Components Epoxy Potting Compound For Encapsulation
Products Description
EP-106A/ B is two-part epoxy potting adhesive. After cured, it is black with a smooth and bright surface. Property: excellent electrical performance and heat resistance. Typical applications include encapsulation, potting and assembly of electronic and magnetic components.


Using Technology
|
Item |
Unit or Condition |
EP-106A/B |
|
Mixing Ratio |
Weigh Ratio |
5:1 |
|
Mixed viscosity |
25 0C mPa*s, |
2000-3000 |
|
Up Time |
180g, 25 0C/min |
40 |
|
Curing conditions |
0C/hrs |
25 0C*6-10h or 60 0C*1.5h |
Usage
1. Keep the goods which wants to pot dry and cleaning.
2. Before use, stir the part A fully.
3. Please take as ratio and make sure for the weigh accurately. The glue should be stirred fully after the Part A and Part B mixed.
4. Please use promptly after the glue has been stirred fully, and use up the mixed glue in up time.
5. After encapsulated, the glue will gradually infiltrate to the gaps, so you can encapsulate once time if necessary.
6. During curing, please keep the environments cleaning to avoid the dirt dropping into the uncured glue.
Cured Properties
|
Item |
Unit or Condition |
EP-106A/B |
|
Hardness |
25 0C, Shore-D |
85 |
|
Volume resistivity |
25 0C, Ω·cm |
>1015 |
|
Surface resistivity |
25 0C, Ω |
>1014 |
|
Insulation intensity |
25 0C, kV/mm |
>22 |
|
Dielectric constant |
25 0C,1MHZ |
4.2±0.1 |
|
Compression strength |
N/mm2 |
>25 |
|
Bending strength |
N/mm2 |
>10 |
|
Impact strength |
N/mm2 |
>6 |
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