Thermal Conductive Flame Retardant Silicone Potting Compound for Electronic Components
Product Description
Performance Data
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Project |
Component A |
Component B |
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Pre-curing property |
Surface |
Black liquor |
White or light yellow liquid |
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Viscosity(mPa.s,GB/T 2794) |
4000~8000 |
4000~8000 |
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Density(g/ml,GB/T 13354) |
1.61-1.65 |
1.61-1.65 |
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Basic chemical composition |
Polyorganosilox-ane |
Polyorganosilox-ane |
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Mixed characte-ristic |
Mixed weight ratio |
1:1 |
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Mixed viscosity(mPa.s,GB/T 2794) |
4000~8000 |
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Operation time(min@25℃) |
20-50(adjustable) |
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Curing time(h@25℃) |
8-16 |
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Curing time (min@80℃) |
15~30 |
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Characteristics after cur-ing |
ShoreA |
67±5 |
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Tensile strength(MPa,GB/T 528) |
≥0.8 |
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Fracture elongation(%)GB/T 528 |
≥60 |
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Thermal conductivity [W/(m ·K),ASTM D5470] |
≥0.6 |
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Volume resistivity(Ω ·cm,GB/T 1692) |
≥1.0×1014 |
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Dielectric strength(kV/mm,GB/T 1695) |
≥21 |
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Dielectric constant(1.2 MHz,GB/T 1693) |
2.9 |
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Temperature range(℃) |
-50~200 |
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Core Advantages
1.The two-component 1:1 mixing ratio is convenient to operate and ensures uniform mixing.
2. It has low viscosity and good fluidity, facilitating void filling and full penetration.
3.Dual curing methods (indoor/thermal curing), flexibly adapting to different production processes.
4.Excellent thermal conductivity, effective for heat dissipation of electronic components.
5.Flame retardant performance provides safety protection for electrical equipment.
6.It has excellent electrical insulation, a very high volume resistivity and dielectric strength.
7.Wide temperature resistance (-50℃ to 200℃), good elasticity after curing, and aging resistance
8. Waterproof and moisture-proof, suitable for harsh working environments.
9.It has good repairability and is convenient for the subsequent maintenance of the packaging equipment.
10.Non-hazardous, safe for storage, transportation and use
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FAQ
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