Factory Thermally Conductive Silicone Sealant Thermal Potting Compound Glue
Products Description
Thermal Compound Paste is a thermal interface material used between electronic components and heat sinks. It is designed to fill the tiny gaps on the contact surface between the two, reduce thermal resistance, and improve thermal conduction efficiency. The material is usually composed of thermal conductive fillers, high-temperature synthetic oils, stabilizers, and additives. It is in a uniform paste state and is commonly gray or white. Thermal conductive fillers such as aluminum oxide (Al₂O₃), aluminum nitride (AlN), etc. provide thermal conductivity; high-temperature synthetic oils ensure good wettability and spreadability; stabilizers and additives optimize its viscosity, temperature resistance, and long-term stability. In applications, thermal conductive paste fills the tiny gaps between electronic components and heat sinks, reduces the thermal resistance of the air layer, and improves thermal conduction efficiency. Its performance is affected by factors such as thermal conductivity, thermal resistance, viscosity, and operating temperature range. Thermal conductive paste is widely used in heat dissipation management of computer CPUs, GPUs, LED lighting, servers, power amplifiers, and other equipment.
Features
High thermal conductivity
The thermal conductivity of Thermal Compound Paste reaches 0.6 W/(m·K), which means that it can effectively transfer the heat generated inside the device and avoid overheating to damage electronic components. Thermal conductivity is a key indicator to measure the performance of thermal conductive materials, and higher thermal conductivity ensures that electronic products can maintain a lower temperature under high-load working conditions, improving the stability and service life of the equipment.
Excellent adhesion and stability
The product has a ductility strength of more than 1.2 MPa, has extremely strong adhesion, and can be stably adhered to the surface for a long time. Its elastic elongation is also more than 180%, and it is not easy to fall off or crack even when the material is under stress or the environment changes. Such characteristics enable it to maintain good thermal conductivity even in high-temperature and high-pressure working environments, avoiding hardware failures caused by poor heat dissipation.
Wide operating temperature range
The operating temperature range of Thermal Compound Paste is -50°C to 200°C, which can adapt to a variety of extreme environmental conditions. Whether in low or high temperature environments, the material can maintain good performance and will not fail due to temperature fluctuations. This makes the product suitable for a variety of high-performance electronic devices, such as computers, servers, automotive electronics, industrial control systems, etc.
Fast curing and efficient operation
The material takes 6-8 hours to fully cure, and only 20-40 minutes to cure in a heating environment of 80°C. The fast curing characteristics can greatly save time and improve work efficiency during production or maintenance. Compared with other ordinary thermal conductive paste products, this feature is particularly suitable for large-scale production and emergency repair occasions.
Specification
Thermally Conductive Silicone Sealant Thermal Potting Compound Glue
|
Item |
SC-8501 |
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|
Uncured |
Appearance |
Part A: black; Part B:white |
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Gravity(g/ml) |
Part A: 1.57-1.60; Part B: 1.57-1.60 |
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|
Viscosity( 25°C / cP) |
Part A: 3000±500; Part B:2400±500 |
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|
Mix ratio (by weight) |
1:1 |
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Mix viscosity( 25°C /cp) |
2900±500 |
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Operational time( 25°C /h) |
1 |
|
|
Completely curing time(25°C/ h) |
6-8 |
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Heat curing time(80°C/min) |
20-40 |
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|
Cured |
Strength of extension/MPa |
≥1.2 |
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Elongation at break /% |
≥180 |
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|
linear shrinkage /% |
≤0.3 |
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|
Dielectric strength(Kv/mm) |
≥20 |
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|
Volume resistivity /Ω.cm |
≥1.0×1014 |
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|
Working temperature (°C) |
-50~200 |
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|
Hardness(shore A) |
55±5 |
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Salt spray test |
Passed |
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Flame retardant level |
UL 94 V-0 |
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Thermal conductivity [W/(m*K)] |
≥0.6 |
Applications
Packing & Delivery
7.5kg/drum, 25kg/drum package.
Why Choose Us?
The company collaborates with both the Institute of Chemistry, Chinese Academy of Sciences and the College of Materials Science and Engineering, Xiamen University, jointly establishing an industry-academia-research platform. It also recruits Ph.D. and graduate students from the two research institutes as key technical personnel for the R&D team. With nearly 19 years of development, the company boasts a highly skilled and experienced R&D team, focusing on the research, development, and production of electronic industrial adhesives, thermal interface materials, and soldering materials. It provides customers with solutions, including product development, simulation testing, and adhesive application processes.
FAQ
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