Factory Direct Price Flexible Heat Transfer phone thermal pad
Products Description
Phone thermal pad adopts advanced heat dissipation technologies such as semiconductor cooling or steam chamber cooling to quickly transfer the heat generated by the CPU, GPU and other components of the mobile phone to the outside, effectively reducing the temperature of the mobile phone. It is applicable to various models of mobile phones. Some products can be used in combination with different phone sizes and thicknesses by adjusting the clips or using magnetic stickers. Our thermal conductive silicone pad is soft in texture and can adapt to various irregular surfaces, fill gaps and prevent air retention. Moreover, our thermal interface material pads have high insulation properties, which can effectively prevent short circuits of components and are suitable for use in various mobile phone models.
benefits
We were established in 2005 and are a specialized, refined, distinctive and innovative enterprise as well as a national high-tech enterprise engaged in the research and development, production, sales and technical services of fine electronic adhesives, thermal conductive materials and electronic solders.Our phone thermal pad is equipped with a semiconductor cooling chip and a large-sized cooling fan. It can quickly dissipate the heat of the mobile phone and transfer the heat away through the heat sink and fan. It adopts a magnetic design and can be cut or laminated into shape. There is no need for curing or clamping. It can be directly attached to the back of the mobile phone, which is convenient, fast and saves assembly time.
Packing & Delivery
Some of Our Partners
More than 80 customers from 15 countries in the past 19 years.
FAQ
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