Thermal Conductive Insulation Mat

Product Description

Thermal Conductive Insulation Mat is a material that combines thermal conductivity and insulation functions. It is usually composed of a high-performance silicone matrix and a special thermal conductive filler. Its main function is to improve the efficiency of heat conduction through thermal conductive fillers, and at the same time, the special thermal insulation layer design effectively blocks the loss of heat to ensure stability in high-temperature working environments. This material has a high thermal conductivity and can quickly transfer the heat generated by electronic components or other heat sources to the cooling system or other components that need to handle heat. At the same time, its thermal insulation function effectively reduces unnecessary heat diffusion and avoids thermal damage to surrounding components. Thermal conductive insulation mats are widely used in electronic devices, especially in high-power density components or devices with high thermal management requirements.

Features

Efficient interface filling capability
Thermal Conductive Insulation Mat uses high-quality silicone material, whose excellent fluidity and softness enable it to very effectively fill the tiny gaps between electronic devices and battery packs. This feature is particularly suitable for thermal management applications with complex shapes or irregular gaps. During installation, the material can adapt to different contact surfaces to form a complete thermal interface, ensuring that heat is quickly and effectively dissipated from the core of the device. This excellent interface filling ability helps to improve the heat dissipation efficiency of the entire device, avoid hot spots caused by poor contact, and ensure the long-term stability and reliability of electronic components.

Self-adaptation to high-pressure environment
The thermal conductive pad can maintain stable performance under high-pressure environment. Its excellent compression performance allows it to maintain good thermal conductivity under high pressure, and it will not lose elasticity or performance degradation due to excessive compression. Compared with some traditional heat dissipation materials, Thermal Conductive Insulation Mat can still maintain appropriate compressibility under high pressure, ensuring close contact with the device surface and further optimizing the heat dissipation effect. Especially in the battery management system (BMS), the high voltage and temperature difference in the battery pack vary greatly. The high-voltage adaptability of the thermal conductive pad can effectively improve the heat dissipation performance of the battery and avoid overheating or performance degradation caused by heat accumulation.

Optimized low pressure difference characteristics
The design of the Thermal Conductive Insulation Mat allows effective thermal conductivity at low pressure. This feature is very important for some high-density packaged electronic devices. In these devices, excessive contact pressure often leads to excessive compression of the thermal conductive material, which in turn affects its thermal conductivity. Relatively speaking, the thermal conductive pad can still conduct heat efficiently under low pressure and optimize the overall heat dissipation performance of the device. This makes it more suitable and advantageous in applications that require fine temperature control, such as high-frequency communication equipment, microprocessors, etc.

High chemical resistance
Thermal Conductive Insulation Mat has strong tolerance to a variety of chemicals and can resist corrosion from common chemicals such as oils, solvents, acids and alkalis. This feature enables it to work stably in some harsh industrial environments, especially in equipment involving chemical processing and cleaning. For equipment exposed to harsh environments, such as industrial automation equipment, automotive electrical systems, etc., the chemical resistance of thermal conductive pads greatly extends their service life and reduces maintenance frequency and costs. This feature also makes the product highly adaptable in multiple industries and can meet the corrosion resistance requirements of different industries for materials.

Bulk Thermal Conductive Insulation Mat Silicone Gap Filler Pad

* High thermal conductivity module
* New energy vehicles
* Microprocessors, memory chips and graphics processors
* Network communication equipment
* Car equipment, charger
* High-speed hard disk drive

Packaging of thermal silicone gap pad/ conductive pad / thermal interface pad Carton boxes size: 270mm(L)*170mm(W)*40mm(H)
Packaging Details: The normal package is carton box, if export quantities are too much, we will put the carton boxes on the planker, and then pack the whole planker up to transport. Port: Xiamen or Guanghzhou
 

Established in 2004, Xiamen JOINY Electronics Co., Ltd.is a high-tech enterprise which dedicates to develop, produce thermal conductive materials, and to provide thermal management solutions as well.Our company collaborates with both the Institute of Chemistry, Chinese Academy of Sciences and the College of Materials Science and Engineering, Xiamen University, jointly establishing an industry-academia-research platform. It also recruits Ph.D. and graduate students from the two research institutes as key technical personnel for the R&D team. We are committed to meeting customer needs by delivering high-quality products and providing fast and flexible services to maximize customer value. Through our dedication, we have established strong partnerships with major new energy vehicle manufacturers, telecommunications companies, leading smartphone brands, and professional equipment manufacturers worldwide, enabling us to serve customers globally.

More than 80 customers from 15 countries in the past 19 years.

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