One-Part Epoxy Red SMT Adhesive for Consumer Electronics SMT Assembly
Product Description
It features high bonding strength, ideal thixotropic property and stable viscosity, perfectly suitable for stencil printing process. After thermal curing at 150℃ for 180s, it shows high hardness, high glass transition temperature, low thermal expansion coefficient, excellent tensile strength and shear strength. It provides reliable fixing force for all kinds of SMD components, great for pre-bonding and reinforcement before wave soldering, widely used in PCB circuit boards and electronic SMT assembly industry.
Performance Data
| Project | Representative value | ||
| Before curing | Appearance (visual inspection) | Red paste | |
| Viscosity (GB/T 2794-1995, Pa · s) | 300~600 | ||
| Thixotropic index (Ti) | 5±0.5 | ||
| Density (GB/T 13354-1992, g/cm³) | 1.42±0.05 | ||
| Condition of cure | Temperature ( ℃ ) | 150 | |
| Time (s) | 180 | ||
| After curing | Hardness (GB/T 2411-2008, D) | 84±2 | |
| Glass transition temperature (ISO 11359-2, ℃) | ≥92 | ||
| Expansion coefficient (ISO 11359-2, ppm.K-1) | a1:65/a2: 175 | ||
| Tensile strength (GB/T 1040.2-2006, MPa) | ≥38 | ||
| Fracture elongation (%) (GB/T 1040.2-2006) | 2±1% | ||
| Shear strength (GB/T 7124-2008, MPa) | ≥14.5 | ||
| Thrust (N, sheet resistance device) | >35 | ||
| Dielectric strength (GB/T 1408.1-2006, KV/mm) | ≥22 | ||
| Volume resistance (GB/T 1410-2006, Ω·cm) | ≥1.0* 1014 | ||
| Surface resistance (GB/T 1410-2006, Ω) | ≥1.0* 1014 | ||
Core advantages
1.One-component formula, ready to use, no mixing required
2.Red paste form, moderate viscosity 300~600 Pa·s, easy dispensing and screen printing
3.Ideal thixotropy index Ti=5±0.5, no sagging, precise glue dot shaping
4.Excellent low-temperature storage stability, storage at -5℃~5℃ up to 6 months
5.High temperature resistance & high Tg ≥92℃, stable performance after curing
6.Low thermal expansion coefficient, less deformation for precision electronics
7.Super high bonding strength: tensile ≥38MPa, shear ≥14.5MPa, thrust >35N
8.Outstanding electrical insulation: dielectric strength ≥22KV/mm, volume resistivity ≥1.0×1014 Ω·cm
9.Cured hardness Shore D 84±2, strong structural fixing ability
10.Perfectly compatible with SMT stencil printing and dispensing process
11.Reliable pre-fixing effect for SMD components before wave soldering
12.Anti-aging, excellent comprehensive physical and electrical properties
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