White Rigid Resin High Hardness 3D Printing UV-Curable Resin
Products Description
APS-5100D is a high-performance white rigid resin specifically designed for 3D printing applications, combining outstanding mechanical properties with reliable curing performance. As a UV-curing material, it cures rapidly under ultraviolet light (slowly under sunlight) and achieves the best results after the recommended water curing (2-5 minutes), ensuring the quality and dimensional stability of the printed parts.

Feature
This rigid resin features an impressive Shore hardness of 85D, a flexural strength of 92MPa and a tensile strength of 44MPa, making it an ideal choice for manufacturing functional prototypes, industrial components and high-strength hobby parts. It features a low shrinkage rate of less than 2% and a viscosity of 330cps (at 25°C), ensuring smooth printing, minimal warpage and precise replication of complex details - ideal for the 3D printing needs of both professionals and enthusiasts.
The liquid density of TJ-5100D is 1.12g/cm³, its heat distortion temperature is 67°C, and its shelf life is 12 months (when properly stored). It has long-term availability and adaptability to various printing environments. It is non-toxic, easy to operate and compatible with most UV 3D printers, providing an economical and high-quality solution for 3D printing projects that require rigidity, precision and consistent performance.
Store in a cool, dry and dark place (below 25°C) to maintain the integrity of the product. Follow the standard safety precautions during use to ensure the best effect and personal protection.
Performance
|
Product Parameters |
Test Standard |
Value (Cured) |
Value (Uncured) |
|
Brand Name/Model No. |
- |
APS-5100D |
- |
|
Color |
- |
White |
- |
|
Hardness (Shore D) |
ASTM D2240 |
85D |
- |
|
Viscosity (25°C, cps) |
ASTM D7867 |
330 |
- |
|
Liquid Density (g/cm³) |
- |
1.12 |
- |
|
Flexure Strength (MPa) |
ASTM D790 |
92 |
89 |
|
Flexural Modulus (MPa) |
ASTM D790 |
2306 |
2114 |
|
Tensile Strength (MPa) |
ASTM D638 IV |
44 |
40 |
|
Elongation at Break (%) |
ASTM D638 IV |
16 |
14 |
|
Tensile Modulus (MPa) |
ASTM D638 IV |
2350 |
2092 |
|
Impact Strength (J/M) |
ASTM D256 |
27 |
26.5 |
|
Heat Distortion Temperature (0.45MPa, °C) |
ASTM D648 |
67 |
- |
|
Shrinkage (%) |
- |
<2 |
- |
|
Shelf Life |
- |
12 Months |
- |
|
Curing Method |
- |
UV Light Curing (Water Post-Curing Recommended: 2-5 mins) |
Slow Curing in Sunlight |
Company Profile







FAQ
Q1.Are you a trading company or a manufacturer?
We are a professional manufacturer with independentR&D and production capabilities, focusing on thermal management and electronic adhesive solutions.
Q2.How do you ensure product quality?
We implement a strict three-step quality control system to ensure stable and reliable products:
Pre-production: Provide customized samples for confirmation to align with your exact requirements
In-production: Conduct real-time quality sampling and process monitoring
Pre-shipment: Carry out 100% final inspection to eliminate defective products
Q3.What products can you provide?
Our core product line covers comprehensive thermal management and electronic bonding solutions:
Thermal conductive series: Thermal Gap Pad, Thermal Gel, Thermal Grease
Bonding series: Electronic Adhesive
Assembly series: Soldering Materials
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