Fast-Drying Electronic Component Adhesive with UV Curing Technology
Products Description
AG50820 is a solvent-free, single-component UV/humidity dual-curing adhesive with excellent extrusibility and molding properties. It delivers superior curing strength, adhesive performance, and moisture resistance, ensuring high reliability. The adhesive features a fluorescent UV indicator for easy detection of adhesive leakage or insufficient application. Ideal for three-proof protection of printed circuit boards and components, it also enhances the vibration and impact resistance of printed circuit board reinforcement and bonding operations across various materials.
Main Features
1.Equipped with a fluorescent ultraviolet indicator for easy inspection.
2.UV / moisture curing.
3.It exhibits excellent adhesion to various substrates, including glass, metal, PCB, and PC.
4.The coating has high moisture resistance and good reliability.
5.100% solid content, compliant with environmental standards including RoHS, HF, and REACH.
Performance
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Appearance (visual) |
Fluorescent light yellow translucent solid |
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Hardness( D ) |
80±2 |
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Tensile strength |
40 |
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Fracture elongation |
5.5 |
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Shear strength |
>6 |
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Water absorption rate |
<0.3 |
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Tensile strength(MPa) |
32 |
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Volume resistivity |
>1.0*1014 |
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Surface resistance |
>1.0*1013 |
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Company Profile
FAQ
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