High Conductivity Thermal Pad

Product Description
 

High Conductivity Thermal Pad is an interface material used for thermal management of electronic equipment. It is mainly composed of a silicone matrix and a high thermal conductivity filler in the form of a soft sheet. It is designed to fill the tiny gap between electronic components and the heat sink, reduce thermal resistance, and improve heat conduction efficiency. The material has excellent thermal conductivity, moderate hardness and elasticity, and can work stably for a long time in a high temperature environment. Its thermal conductivity is affected by the filler type, content, and base material. Common fillers include alumina, aluminum nitride, silicon nitride, etc., and the base material is mostly silicone. High thermal conductivity silicone pads are widely used in heat dissipation systems in the fields of LED lighting, computer CPUs, power modules, and communication equipment.

Features

High thermal conductivity improves heat dissipation efficiency
The thermal conductivity of High Conductivity Thermal Pad reaches ≥5.0 W/m·K (according to ASTM D5470 standard), which is a high thermal conductivity grade material. This value ensures that it can efficiently transfer heat in high-power electronic devices, shorten the heat conduction path from the heat source to the heat sink, significantly reduce the contact thermal resistance, and improve the overall heat dissipation efficiency, thereby reducing the device performance degradation or thermal failure caused by heat accumulation.

Multiple thicknesses available
The product thickness ranges from 0.5 mm to 5.0 mm (according to ASTM D374 standard), supports thermal interface filling of different gaps, and is suitable for a variety of heat dissipation components with uneven sizes or complex structures. This design ensures good contact and filling under different assembly tolerances, improving the consistency of the thermal interface and thermal conductivity stability.

Both softness and adaptability
The hardness of High Conductivity Thermal Pad is Shore 00 55±5 (according to ASTM D2240 standard), with good softness, which can effectively fit the surface of the device and fill in small uneven areas. This performance increases the actual contact area between the thermal interface material and the device, reduces the interfacial thermal resistance, and avoids mechanical stress on the components during assembly.

Stable thermal and mechanical properties
The product has a specific gravity of 3.4±0.2 (according to ASTM D792), indicating that it has a high internal filler ratio and dense thermal paths, ensuring stable thermal conductivity. The tensile strength is 8 psi (according to ASTM D412), which maintains soft properties while having basic structural stability, which helps the material not deform or peel during long-term use and improves reliability.

* High thermal conductivity module
* New energy vehicles
* Microprocessors, memory chips and graphics processors
* Network communication equipment
* Car equipment, charger
* High-speed hard disk drive
 

Packaging of thermal pad/ conductive pad / thermal interface pad Carton boxes size: 270mm(L)*170mm(W)*40mm(H)
Packaging Details: The normal package is carton box, if export quantities are too much, we will put the carton boxes on the planker, and then pack the whole planker up to transport. Port: Xiamen

The company collaborates with both the Institute of Chemistry, Chinese Academy of Sciences and the College of Materials Science and Engineering, Xiamen University, jointly establishing an industry-academia-research platform. It also recruits Ph.D. and graduate students from the two research institutes as key technical personnel for the R&D team. With nearly 19 years of development, the company boasts a highly skilled and experienced R&D team, focusing on the research, development, and production of electronic industrial adhesives, thermal interface materials, and soldering materials. It provides customers with solutions, including product development, simulation testing, and adhesive application processes.

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