High-strength silver conductive epoxy adhesive for bonding electronic components
Products Description
This is a two-component silver conductive epoxy resin adhesive with stable performance and excellent bonding strength. It can be cured at room temperature or under heating conditions, is easy to operate and widely used. This adhesive features reliable electrical and thermal conductivity and is widely used for conductive bonding between various materials.
Performance Data
| Item | Unit | EP-01AB | |
| Color | Silver | ||
| Mixing ratio | Weight ratio | A:B=10:1 | |
| Operational time | 25/h℃ | 2 | |
| Cure time | h | 25×℃12-24h or 80×1h℃ | |
| After cured | Shearing strength (Al-Al) | kg/cm3 | >50 |
| Using temperature | ℃ | -40℃ ~ +200℃ | |
| Thermal conductivity | W/(m*K) | 8.5 | |
| Volume resistance | ohm*cm | 1×10-3 ~ 3×10-4 | |
Advantages
1.High bonding strength and stable performance
2.Excellent electrical conductivity, low volume resistance
3.High thermal conductivity, efficient heat dissipation
4.Cured at room temperature or by heating
5.Wide working temperature range, suitable for harsh environments
6.Good adhesion to metals, ceramics, glass and other substrates
7.Easy to mix and handle, suitable for manual or automated production
Typical Applications
1.Metal component conductive bonding
2.Electronic component assembly and connection
3.Ceramic and glass conductive bonding
4.Circuit maintenance, conductive connection and fixation require
5.Electronic products with both conductivity and bonding properties
6.High thermal conductivity and conductive connection parts
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FAQ
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