High quality electrically conductive thermal pad for lED CPU


Product description
Electrically conductive thermal pad is a composite material with high thermal conductivity and electrical insulation performance, which is widely used in the field of thermal management of electronic equipment. Its core structure is composed of a silicone rubber substrate and a high thermal conductivity filler (such as alumina, boron nitride or carbon fiber).
Product Features
High-efficiency Thermal Conductivity
The electrically conductive thermal pad uses a composite material of high-purity boron nitride ceramic powder and silicone rubber. With the high thermal conductivity of boron nitride (thermal conductivity can reach 300-400W/(m・K)), and a special mixing process, the ceramic powder is evenly dispersed in the silicone rubber matrix to form a continuous thermal network. Compared with ordinary thermal pads, this structure can reduce thermal resistance by about 40%, and can quickly export heat when the electronic equipment is running, effectively control the temperature rise of the equipment, and ensure the stable operation of the components.
Stable Conductivity
The electrically conductive thermal pad has built-in micron-level silver-plated copper powder, and its volume resistivity is as low as 0.01Ω・cm. Through precise proportioning and calendering molding process, the silver-plated copper powder is in close contact with the silicone rubber to build a stable conductive channel. Under different temperature and pressure environments, the surface resistance is always kept below 10^-3Ω, which can effectively release static electricity, avoid electronic components from malfunctioning due to static interference, and ensure the stable operation of the circuit system.
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