The problem of heat conduction is a key issue that many equipment development engineers need to address. The heat generated during equipment operation is due to the fact that in reality, the conversion of electrical energy into other target energy is accompanied by losses. Most of the lost energy will dissipate outward in the form of heat, which is one of the main reasons for the generation of heat during equipment use.
The internal heat circulation of the equipment is not easy, which leads to the accumulation of heat and increases the temperature. The aging rate of materials is accelerated at high temperatures, and temperature sensitive semiconductors may malfunction. Therefore, it is necessary to conduct heat to the outside to reduce the temperature. Installing heat dissipation modules on the surface of the heat source is the most common way of heat dissipation, but there are gaps between the heat source and the heat sink, which can hinder the conduction of heat and affect the overall heat dissipation effect.
As a kind of material specially used to solve heat conduction problems, heat conduction materials have broad application prospects in all walks of life. There are many heat conduction materials, such as thermal conductive silicon film, thermal conductive phase change sheet, thermal conductive silicon tape, thermal conductive silicone grease, thermal conductive gel, silicon free thermal conductive gasket, carbon fiber dimensional thermal conductive gasket, etc. Each type of heat conduction material has its unique advantages and can be selected according to product needs.
Thermal conductive silicon gel is a kind of gelatinous material which is made of silicone resin as the matrix, thermal conductive filler and bonding material added in a certain proportion, and processed by a special process. It is also called thermal conductive silica gel mud and thermal conductive gel in the industry. It has high thermal conductivity, low thermal resistance, and good thixotropy, making it an ideal material for applications with large gap tolerances. It is filled between electronic components that need to be cooled and heat sinks/shells, making them in close contact, reducing thermal resistance, and quickly and effectively lowering the temperature of electronic components, thereby extending their service life and improving their reliability.
As a relatively new type of thermal conductive caulking material, thermal conductive silicon gel has high thermal conductivity and low interface thermal resistance. Given proper pressure, it will fully fill the gaps and holes, reducing the contact thermal resistance between the two. Thermal conductive silicon gel is simple to use, can be coated according to the size of the coated plane, and can be applied to automatic dispensing equipment to achieve automatic operation.