After prolonged operation of mobile phones and computers, in addition to the body heating up, there is a possibility of the body crashing or even internal circuit short circuiting, causing fire accidents. Electrical equipment cannot avoid generating heat when used because heat is generated when current passes through resistors, which makes it difficult for heat to circulate inside the machine, resulting in local temperature rise of the equipment.
High temperature can cause temperature sensitive electronic components to malfunction, and at the same time, the aging rate of materials accelerates under high temperature, which can easily cause parts to catch fire. Therefore, it is necessary to transfer heat to the outside in a timely manner. The commonly used method is to install a heat sink above the heat source to guide the heat from the surface of the heat source to the outside, thereby reducing the temperature.
With the development of science and technology, the heat dissipation needs of high-tech products have become increasingly high, especially in the communication industry. The popularization and application of 5G technology have increased the power of the hardware it is matched with, the heat generated is also higher, and the requirements for materials are also increasing. Most of the thermal conductive materials on the market are made of silicone oil as raw material. Thermal conductive materials containing silicone oil may precipitate small molecules of silicone oil under high temperature and pressure for a long time, which may adsorb around the parts or on the heat sink, affecting the performance of the equipment. This is even more unacceptable for silicon sensitive equipment, so some non silicone oil thermal conductive materials need to be used.
Silicon free thermal pad is a soft thermal gap filling material that does not contain silicone oil. It has high thermal conductivity, low thermal resistance, high compressibility, and controllable hardness. It does not evaporate small siloxane molecules in compressed and heated operating environments, avoiding adsorption on PCB boards due to siloxane molecule evaporation and indirectly affecting the performance of the body. The silicon free thermal pad acts on the gap between the heat source and the heat sink/shell, effectively eliminating air at the interface due to its good flexibility, reducing interface thermal resistance, and improving thermal conductivity.
The infrastructure of the communication industry is the foundation of the entire information network, so in order to ensure that equipment can operate stably for a long time, in addition to requiring high thermal conductivity thermal conductive materials, it is also important to pay attention to their material composition to avoid affecting their operation. Silicon free thermal conductive gaskets can effectively ensure thermal conductivity while not contaminating equipment parts due to the absence of silicon atoms.