The following are the main product series that our company:
1. Thermal Pad
A gasket-like material adhered between electronic components and heat sinks to evenly transfer heat.
It mainly has insulating and compressible properties, filling the gaps caused by uneven surfaces.
2. Thermal Paste, Thermal Grease
A viscous material applied between chips such as cpus and Gpus and heat sinks to enhance thermal conductivity.
Because it is in liquid/semi-liquid form, it can fill tiny gaps.
3. Adhesive
Not only are there simple fixes, but also special adhesives with thermal conductivity and electrical insulation properties.
It is used for the assembly, protection and packaging of electronic components.
4. Conformity coating (Moisture-proof oil · Coating agent)
A thin insulating film coating that protects circuit boards (PCBS) from external moisture, dust and chemical substances.
There are various materials such as acrylic, silicone, polyurethane, etc.
5. Solder (Solder Paste, solder material)
An alloy used to connect metals to metals.
In the electronics industry, tin-lead or non-alloying (tin-copper-silver) materials are mainly used.
6. Silicone Foam
The foam material made of silicone has the functions of shock absorption, dust prevention, heat dissipation and insulation.
It is mostly used for mechanical cushioning materials or gap filling.
7. Thermal interface materials (TIM, thermal conductive interface materials)
The products mentioned above, such as hot pads and hot pastes, are collectively referred to as fields.
A group of materials located between the heat-generating component and the heat-dissipating component, which can reduce thermal resistance and efficiently transfer heat.
Our manufacturer has been involved since 2005.That is to say, since 2005, we have been a company specializing in the production of thermoelectric interface materials.
