Financial world November 30, 2024 news, the State Intellectual Property Office information shows that the company applied for a patent entitled "a kind of thermally conductive silicone rubber and its preparation method", Publication No. CN 119039789 A, the date of application in August 2024.
According to the abstract of the patent, the present invention relates to the technical field of thermally conductive silicone rubber, and specifically relates to a thermally conductive silicone rubber and its preparation method. The present invention proposes a thermally conductive silicone rubber and a preparation method thereof. A thermally conductive silicone rubber, the raw material of the silicone rubber includes: end vinyl polydimethylsiloxane, vinyl MQ resin, hydrogen-containing silicone oil, ethynyl cyclohexanol, and modified silver powder; and the modified silver powder is a mixture containing silicone resin and silver powder. In the thermally conductive silicone rubber provided by the present invention, by using the silver powder coated with the silicone resin, the thermally conductive silicone rubber of the present invention has a suitable fluidity and a high thermal conductivity before curing, and is able to meet the market demand for the use of ultra-high thermal conductivity silicone rubber. The thermally conductive silicone rubber provided by the present invention can be applied to structural heat dissipation components such as ultra-high power light emitting chips.
