People always say that life is like a journey, with setbacks, troubles, failures, and injuries like roadblocks on the road, hindering progress. Defeat them, cross them, and eventually reach the end of the journey. This is a philosophy of life, and thermal resistance is even more so for silicon free thermal pads.
Silicon free thermal conductive gasket is a member of thermal conductive materials, and it is also recommended and used by many high-tech industries and high-precision equipment enterprises. Silicon free thermal conductive gasket is a soft thermal gap filling material that does not contain silicone oil. It has high thermal conductivity, low thermal resistance, high compressibility, and controllable hardness. In the operating environment under pressure and heat, there is no volatilization of silicone small molecules, which avoids adsorption on the PCB board due to the volatilization of silicone small molecules and indirectly affects the performance of the body. The silicon free thermal pad acts on the gap between the heat source and the heat sink/shell, effectively eliminating air at the interface due to its good flexibility, reducing interface thermal resistance, and improving thermal conductivity.
The characteristic feature of silicon free thermal pads is that they do not contain silicone oil, and there is no small molecule precipitation of silicone oil during operation, so there is no need for silicone oil precipitation. Therefore, they do not cause pollution to the internal parts of the equipment and are widely used in high-tech fields. At the same time, with the development of society, enterprises have begun to pursue pollution-free and high reliability, so the future application prospects of silicon free thermal conductive gaskets are very promising.
The difference between silicon free thermal pads and thermal conductive silicone film is that their production materials do not contain silicon molecules, so the parameters provided by people when purchasing silicon free thermal pads are almost the same as those of thermal conductive silicone film. However, people often forget the thermal resistance value when purchasing thermal conductive silicone film. So, what is the impact of thermal resistance on silicon free thermal pads?
There is a saying in the industry: purchase based on thermal conductivity, engineering based on thermal resistance. Thermal resistance refers to the temperature difference formed at both ends of an object when heat flow passes through it. Furthermore, thermal resistance refers to the ability of a silicon free thermal pad to hinder heat conduction. The larger the thermal resistance of a silicon free thermal pad, the stronger its ability to hinder heat conduction. As mentioned at the beginning, there will be many obstacles in the journey of life. Crossing them will eventually reach the end of the journey, but it will take a little more time. Thermal resistance, such as the obstacles that hinder heat transfer inside a silicon free thermal pad, is lower, and the faster the heat transfer, the better the thermal conductivity effect.
The selling point of silicon free thermal pads is the absence of small molecule precipitation of siloxane, resulting in extremely low oil yield. However, thermal resistance cannot be ignored. Two sets of silicon free thermal pads with the same parameters except for different thermal resistance values have better thermal conductivity. Therefore, when purchasing silicon free thermal pads, in addition to paying attention to their important data parameters, do not forget their thermal resistance values.