After entering the 21st century, the development and progress of science and technology, as well as the improvement of people's living standards, have made many electronic products popular, such as telephones, computers, etc. However, the current trend of electronic product development tends towards lighter weight and more functionality, so there are also high requirements for the internal operating environment of electronic devices.
Thermal interface materials are widely used in the field of geothermal management, mainly to provide solutions for equipment heat dissipation problems. After the device is powered on, there will be a phenomenon of heating, mainly because the electrical energy cannot be fully converted into other energy, and a part of the energy will be lost, and a large part of this energy will be dissipated in the form of heat. Therefore, people will install heat sinks on the surface of the device's heating source to control the temperature in a timely manner.
Subsequently, it was found that installing a heat sink directly on the surface of the heat source had poor thermal conductivity. Therefore, a thermal interface material was filled between the two to ensure close contact and eliminate air between the gaps, thereby reducing thermal resistance and improving thermal conductivity. Silicon free thermal pad is one of the many thermal interface materials and is also a highly anticipated thermal material. So, what are the advantages of silicon free thermal pad that make people confident in it?
Silicon free thermal pad is a soft thermal gap filling material that does not contain silicone oil. It has high thermal conductivity, low thermal resistance, high compressibility, and controllable hardness. It does not evaporate small siloxane molecules in compressed and heated operating environments, avoiding adsorption on the PCB board due to siloxane molecule evaporation and indirectly affecting the performance of the body. The silicon free thermal pad acts on the gap between the heat source and the heat sink/ shell, effectively eliminating air at the interface due to its good flexibility, reducing interface thermal resistance, and improving thermal conductivity.
There are many advantages to silicon free thermal conductive gaskets, among which the main advantage is the absence of silicone oil precipitation, which is the essential difference between them and thermal conductive silicone sheets. Some people say that silicon free thermal conductive gaskets are derivatives of thermal conductive silicone films, but this statement is not without reason. When people use thermal conductive silicone films, they find that there will be silicone oil precipitation, polluting the circuit. Therefore, based on the idea of pollution-free, silicon free thermal conductive gaskets are made on the premise of thermal conductive silicone films.
The raw materials used for silicon free thermal conductive gaskets are more complex than those used for thermal conductive silicone sheets, and their stability is high. The oil production rate is very low during long-term operation, almost negligible. Therefore, silicon free thermal conductive gaskets are well-known in the industry for their characteristics of no oil production and no silicon precipitation. Currently, with the birth of many high-tech industries, their production equipment requires strict pollution-free environments. Therefore, silicon free thermal conductive gaskets are widely used in these high-precision equipment, sensitive silicon equipment, and pollution-free industries. With the passage of time, the development of the industry has also promoted pollution-free environments, so the market prospects for silicon free thermal conductive gaskets are very broad.